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Thermal & Reliability Study on High Current Thermal Vias & Output Pins應(yīng)用指南

文件來(lái)源:SynQor
文件類(lèi)型:pdf
更新時(shí)間:2011-02-18
文件大小:384K
This application note addresses concerns raised with regards to pin and board heating when high currents (>60A) are driven through thermally relieved plated through hole (PTH) vias. Detailed thermal analysis will show that internal heat generation and resulting temperature rise of the power converter and load board is minimal when using a single thermally relieved via.
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